Thermal Shock Reliability Tests of Multilayer LTCC Modules with Thick Film Conductors

摘要

This paper deals with bent modules based on LTCC (Low Temperature Cofired Ceramic) for electronics related to reliability and of thermal cyclic stress stability in the temperature range from -40°C to +125°C. The interpretation of the thermal shock influence on electrical parameters of built-in conductive paths at bent multiplayer LTCC modules refers to the fatigue of thick film conductors and ceramic materials as well as on failure and broken down initiator.