The objective of this work is to develop a flex-based Flip Chip BGA Package for applications in the domain of 700 I/Os, 5GHz frequency bandwidth and 20W power dissipation. It is also required to meet various reliability requirements within a single development cycle. Design, material and assembly considerations taken to deliver the package performance are discussed and analyzed in this paper. This includes details of the electrical, thermal and structural simulation results as well as verification of the simulations. Considerations and selection of various key packaging materials such as reflowable underfill, thermal interface material and structural adhesive, as well as the assembly process are also explained.
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机译：这项工作的目的是开发一种基于Flex的倒装芯片BGA包，用于700 I / O，5GHz频率带宽和20W功耗的域中的应用。还需要满足单个开发周期内的各种可靠性要求。在本文中讨论和分析了用于提供包装性能的设计，材料和装配考虑因素。这包括电气，热和结构模拟结果的细节以及模拟的验证。还解释了各种关键包装材料的考虑和选择，例如回流底部填充物，热界面材料和结构粘合剂以及组装过程。
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