Dual Band Antenna Switch Modules with Bare SAW Chips Mounted on LTCC

摘要

As an extension of "passive integration" in RF circuit applications, "hetero-mount technology", such that both solderable devices and gold-gold interconnection (GGI) devices are mounted simultaneously on a low temperature cofired ceramic (LTCC) substrate, has been developed. Using this technology, an antenna switch module for European EGSM-DCS dual band system was fabricated. In this module, bare SAW chips were flip-chip-bonded with GGI, and 30 LC components were built-in the LTCC substrate. Corresponding to the strong demand of mobile phone system, this technology provides further miniaturization and integration.