Composite module and a method of preparing the same electronic components of electronic components and method of manufacturing the same, and bare chip mounting structure that of bare chip mounting structure

摘要

electrically connected to the functional element connection for electrodes, one of the element substrate to provide a technique that can be prevented from peeling off from the main surface of the. On one main surface of the element substrate 11, a transmission filter element 13 and the receiving filter element 14, a transmission filter element 13 and the receiving filter element 14 electrically connected to the connection electrode 17, the transmission filter element 13 and the receiving filter elements 14 and are provided with an insulating layer 18 surrounding the connection electrode 17, the insulating layer 18 is formed over at least a portion of a surface of the connection electrode 17. Therefore, since a part of the surface of the connection electrode 17 in a state where the exposed is covered by an insulating layer 18, the transmission filter element 13 and the receiving filter element 14 electrically connected to the connection electrode 17, the element substrate and it can be prevented from peeling from the one main surface of 11.