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Effectiveness of Embedded-SiGe in Strained-SOI Substrates and Implications on Embedded-SiGe Stress Transfer Mechanics

机译:嵌入式SiGe在紧张-SiE基板中的有效性及对嵌入式 - SiGe应力转移力学的影响

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Embedded-SiGe is shown to be fully compatible with strained-SOI substrates. Despite a lack of lateral lattice mismatch between the SiGe and strained-SOI, the resulting drive current improvement from embedded-SiGe is identical for strained-SOI and standard SOI control (where a lateral lattice mismatch is present). This result isolates the vertical lattice mismatch as the source of stress generation from embedded-SiGe. The concept of a critical length of SiGe beyond the vertical Si-SiGe interface is introduced to explain the observed experimental results, and is confirmed by various SiGe epitaxial fill-height and stress relaxation experiments.
机译:嵌入式SiGe显示出与应变SOI基材完全兼容。尽管SiGe和应变 - SOI之间缺乏横向晶格错配,但是由嵌入式SiGe的所得驱动电流改善与应变SOI和标准SOI控制(其中存在横向格式错配)相同。该结果将垂直晶格错配作为嵌入式SiGe的应力产生源。引入超出垂直Si-SiGe界面的临界长度的概念以解释观察到的实验结果,并通过各种SiGe外延填充高度和应力松弛实验证实。

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