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Fracture Toughness Testing of Advanced Silicon Carbide Ceramics Using Digital Image Correlation

机译:使用数字图像相关性的先进碳化硅陶瓷的断裂韧性试验

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The quasi-static fracture toughness (K_(Ic)) of pressureless-sintered and reaction-bonded ceramics was investigated through a four-point bend, chevron-notch testing method. The sample geometry is in accordance with Configuration A of the ASTM C1421 testing standard. Tests were conducted using an electro-mechanical universal testing machine. The digital image correlation (DIC) technique was used to verify stable crack nucleation and growth through recording of the crack mouth opening displacement (CMOD). The reaction-bonded composite displayed a higher K_(Ic) value than the pressureless-sintered ceramic, possibly due to the presence of the silicon phase, which exhibits a quasi-ductile fracture behavior.
机译:通过四点弯曲,凹陷槽试验方法研究了无压烧结和反应键合陶瓷的准静态断裂韧性(K_(IC))。样品几何形状符合ASTM C1421测试标准的配置A.使用机电通用测试机进行测试。数字图像相关(DIC)技术用于通过记录裂缝口开口位移(CMOD)来验证稳定的裂缝成核和生长。反应键合复合材料显示比无压烧结陶瓷的k_(Ic)值较高,可能是由于硅相的存在,这表现出准延展性裂缝行为。

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