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Study of Lanthanum Diffusion in HfO_2-bascd High-k Gate Stack

机译:HFO_2-BASCD高k栅极堆栈中镧扩散的研究

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La_2O_3 has been selected as a threshold voltage (Vt) tuning material for advanced CMOS node because of its uniqueness of reducing effective work function towards nFET band edge by creating dipoles at SiO_2/HfO_2 interface. In this paper, we study the factors which influence the diffusion of La into HfO_2-based gate stack during drive-in anneal. These factors include: (1) Initial La_2O_3 thickness, HfO_2 thickness and drive-in anneal temperature; (2). Crystallization state of HfO_2; (3) Capping material during drive-in anneal. While La diffusion generally follows thermally activated process described by Fick's law and Arrhenius equation, the crystallization of HfO_2 and the TiN cap adjacent to La_2O_3 are also found to greatly affect the amount of diffused La, which ties closely to the Vt tuning ability.
机译:La_2O_3已被选为高级CMOS节点的阈值电压(VT)调谐材料,因为它通过在SIO_2 / HFO_2接口中创建偶极级别来降低NFET带边沿的有效工作功能的唯一性。在本文中,我们研究了在驱动退火期间影响了影响La进入HFO_2的栅极堆叠的因素。这些因素包括:(1)初始LA_2O_3厚度,HFO_2厚度和驱动式退火温度; (2)。 HFO_2的结晶状态; (3)在驾驶退火过程中覆盖材料。虽然La扩散通常遵循Fick Law和Arrhenius方程描述的热激活过程,但也发现HFO_2和La_2O_3附近的锡帽的结晶,以极大地影响扩散的LA的量,这与VT调谐能力密切相关。

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