Study of Seed-Layer Stability on Copper Electrolytic Bath

摘要

In microelectronic field, 3D interconnects are processed by copper electrodeposition using a copper seed-layer to ensure the electrical contact. A uniform and homogeneous seed-layer is necessary to guarantee full filling of structures without any defect. This research work is focused on the seed-layer stability in electrolytic copper bath and its dissolution rate, during the idle time just before the plating.