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Electroless Plating Processes Developing Technologies for Electroless Nickel, Palladium and Gold

机译:化学镀方法开发化学镀镍,钯和金的技术

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Many types of electroless nickel, electroless palladium and gold, are in use today. These deposits and tirtiary alloys of these processes will find greater use in the future as technology advances, demanding different surface characteristics, and different metallurgical properties. A basic understanding of the types of processes and some applications may give rise to new uses for these and other electroless processes. Formulas for electroless nickel solutions, electroless gold and palladium may lead to better understanding and encourage use of some of them, or better still modifications of the formulas included in this paper. In general, proprietary formulas that have been based on solid research and development will be better than the ones included here from published literature.
机译:今天使用了许多类型的化学镀镍,化学钯和金。这些过程的这些沉积物和倾向性合金将在未来发现,随着技术的进步,要求不同的表面特征和不同的冶金特性,将在更大的情况下发现更多使用。对过程类型和某些应用程序的基本了解可能会导致这些和其他无电气过程的新用途。化学镀镍溶液的公式,化学镀金和钯可能会更好地了解并鼓励使用其中一些,或者更好地改变本文中包含的公式。一般来说,基于稳健研发的专有公式将比出版文献中包含的那些更好。

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