Thermal Deformation Measurement of Electronic Packaging Component Using AFM Scanning Moire Method

摘要

The AFM scanning moire method was proposed to measure the in-plane deformation in the micrometer scale. The principle and technique for measuring in-plane deformation using AFM scanning moire method are described. This method was applied to measure the thermal deformation in a quad flat pack (QFP) electronic package at 100 degrees C. The normal strain component (epsilon)_y and the shear strain component(gamma)_(xy) near the die in the QFP package were measured