High resolution AFM scanning Moire method and its application to the micro-deformation in the BGA electronic package

摘要

The formation mechanism of atomic force microscope (AFM) Moire is explained using the transmittance function. The technique for preparing the AFM Molt6 specimen grating is described. The sensitivity and accuracy of this method is analyzed. AFM Moire method is used to measure the thermal deformation ball grid array (BGA) electronic package. The shear strain at the different solders in the BGA package is measured. The result is compared with that from electron beam Moir6 method. The consistent comparison result verifies the AFM Moire method is reliable and effective in the micro-deformation measurement in the electronic package.