Stress intensity factor analysis for an interface crack under residual stress using crack closure integral method

摘要

Thermal stresses, one of the most important causes of interfacial failure between dissimilar materials, arise from different coefficients of linear thermal expansion. An efficient numerical procedure in conjunction with the finite element method (FEM) for the stress intensity factor (SIF) analysis of interface cracks under thermal stresses is presented. The crack closure integral method is modified using the superposition method. The SIF analyses of some interface crack problems under mechanical and thermal loads are demonstrated. Very accurate mode separated SIFs are obtained.