Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

摘要

In this study the fracture mechanics parameters, including the strain energy release rate, the stress intensity factors and phase angles, along the curvilinear front of a three-dimensional bimaterial interface crack in electronic packages are considered by using finite element method with the virtual crack closure technique (VCCT). In the numerical procedure normalized complex stress intensity factors and the corresponding phase angles (Rice, J Appl Mech 55:98–103, 1988) are calculated from the crack closure integrals for an opening interface crack tip. Alternative procedures are also described for the cases of crack under inner pressure and crack faces under large-scale contact. Validation for the procedure is performed by comparing numerical results to analytical solutions for the problems of interface crack subjected to either remote tension or mixed loading. The numerical approach is then applied to study interface crack problems in electronic packages. Solutions for semi-circular surface crack and quarter-circular corner crack on the interface of epoxy molding compound and silicon die under uniform temperature excursion are presented. In addition, embedded corner delaminations on the interface of silicon die and underfill in flip-chip package under thermomechanical load are investigated. Based on the distribution of the fracture mechanics parameters along the interface crack front, qualitative predictions on the propensity of interface crack propagation under thermomechanical loads are given.