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Compatibility of PolySilicon with HfO_2-based Gate Dielectrics for CMOS Applications

机译:多晶硅与基于HFO_2的栅极电介质的兼容性CMOS应用

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Hafnium-based materials such as oxides,silicates and aluminates of hafnium are being widely studied for application as high-K gate dielectric to meet the needs of CMOS scaling.For rapid deployment of high-K gate dielectrics into existing CMOS lines,compatibility of the high-K dielectric with polysilicon gate electrodes is critical.It is therefore necessary to evaluate the stability of the high-K gate dielectric during polySi deposition and CMOS processing.Previous studies [1,2] have reported that exposure to SiH_4 during CVD polySi deposition leads to reduction of HfO_2 and causes high leakage failures.
机译:铪基材料,如氧化铪,硅酸盐和铝酸盐,用于应用于高k栅极电介质,以满足CMOS缩放的需求。对于高k栅极电介质的快速部署到现有的CMOS线,兼容性具有多晶硅栅电极的高k电介质是关键的。因此,需要评估高k栅极电介质期间的高k栅极电介质在多硅沉积和CMOS处理期间的稳定性。另一种研究报告称,在CVD Polysi沉积期间暴露于SiH_4导致减少HFO_2并导致高泄漏故障。

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