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Sputtered barium titanate, lead zirconate titanate, barium strontium titanate films for capacitor applications

机译:溅射钡钛酸钡,锆钛酸铅,钛酸钡薄膜用于电容器应用

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Thin barium titanate(BT), lead zirconate titanate(PZT), barium strontium titanate(BST) films are being developed for use in microelectronics, electromechanical and optoelectronic applications. Thin BaTiO{sub}3, Pb(ZrTi)O{sub}3and (BaSr)TiO{sub}3film capacitor devices were fabricated using RF sputtering techniques. The typical dielectric constant of these film capacitors was in the range of 300 to 1140. These film capacitors had dissipation factors between 0.2% to 0.6% before annealing and 4-6% after annealing. The film capacitors have breakdown voltages in the range of 1×10{sup}5V/cm to 1.2×10{sup}6V/cm. The resistivity was in the range of 10{sup}10 to 10{sup}12 ohm-cm before annealing and 10{sup}13 to 10{sup}14 ohm-cm after annealing. The capacitance of films produced to-date had little dependence on frequency. Thermal cycling in the temperature range of 50 to 300°C had very limited impact on the capacitance and dissipation factor. Measurements of dielectric and material properties are reported.
机译:钛钛酸钡(BT),铅锆酯钛酸铅(PZT),钛酸钡(BST)薄膜正在开发用于微电子,机电和光电应用。薄BATIO {SUB} 3,PB(ZRTI)O {SUB} 3和(BASR)TIO {SUB} 3FILM电容器装置使用RF溅射技术制造。这些薄膜电容器的典型介电常数在300至1140的范围内。这些薄膜电容器在退火之前的0.2%至0.6%之间的耗散因子和退火后的4-6%。薄膜电容器具有1×10 {SUP} 5V / cm至1.2×10 {SUP} 6V / cm的击穿电压。在退火之前,在退火之前,电阻率在10 {SUP} 10至10 {SUP} 12欧姆-CM的范围内,并且退火后14欧姆-CM为14欧姆厘米。迄今为止产生的电影的电容几乎没有对频率的依赖性。在50至300°C的温度范围内的热循环对电容和耗散因子的影响非常有限。报道了电介质和材料特性的测量。

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