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Synthesis of III-N{sub}x-V{sub}(1-x) thin films by N ion implantation

机译:N离子注入的III-N {SUB} X-V {SUB}(1-X)薄膜的合成

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Dilute III-N{sub}x-V{sub}(1-x) alloys were successfully synthesized by nitrogen implantation in GaAs and InP. The fundamental band gap energy for the ion beam synthesized III-N{sub}x-V{sub}(1-x) alloys was found to decrease with increasing N implantation dose in a manner similar to that commonly observed in epitaxially grown GaN{sub}xAs{sub}(1-x) and InN{sub}xP{sub}(1-x) thin films. The fraction of N occupying anion sites ("active" N) in the GaN{sub}xAs{sub}(1-x) layers formed by N implantation was thermally unstable and decreased with increasing annealing temperature. In contrast, thermally stable InN{sub}xP{sub}(1-x) alloys with N mole fraction as high as 0.012 were synthesized by N implantation in InP. Moreover, the N activation efficiency in InP was at least a factor of two higher than in GaAs under similar processing conditions. The low N activation efficiency (<20%) in GaAs can be improved by co-implanting Ga and N in GaAs.
机译:通过在GaAs和InP中的氮气植入成功地合成稀释III-N {亚} X-V {亚}(1-X)合金。发现离子束的基本带隙能量III-N {um} xV {sub}(1-x)合金以增加N植入剂量以与在外延生长的GaN {sub}中常见的方式类似的方式降低XAS {sub}(1-x)和Inn {sub} xp {sub}(1-x)薄膜。 N占领阴离子位点的N的级分(在N植入形成的GaN {Sub}×{Sub}(1-x)层中(1-x)层中的“活性”n)热不稳定并且随着退火温度的增加而降低。相反,通过INP中的N植入合成具有高达0.012的N摩尔分数的热稳定型INN {Sub}(1-X)合金。此外,在类似的加工条件下,INP中的N激活效率比GaAs高至少两个。通过在GaAs中植入Ga和N,可以改善GaAs中的低N激活效率(<20%)。

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