首页> 外文会议>Symposium on wind-bandgap semiconductors for high-power, high-frequency and high-temperature applications >Conducting (Si-doped) aluminum nitride epitaxial films grown by molecular beam epitaxy
【24h】

Conducting (Si-doped) aluminum nitride epitaxial films grown by molecular beam epitaxy

机译:通过分子束外延生长的导电(Si掺杂)氮化铝外延膜

获取原文

摘要

As a member of the III-V nitride semiconductor family, AlN, which has a direct energy-gap of 6.2eV, has received much attention as a promising material for many applications. However, despite the promising attributes of AlN for varioussemiconductor devices, research on AlN has been limited and n-type conducting AlN has not been reported. The objective of this research was to understand the factors impacting the conductivity of AlN and to control the conductivity of this materialthrough intentional doping. Prior to the intentional doping study, growth of undoped AlN epilayers was investigated. Through careful selection of substrate preparation methods and growth parameters, relatively low-temperature molecular beam epitaxialgrowth of AlN films was established which resulted in insulating material. Intentional Si doping during epilayer growth was found to result in conducting films under specific growth conditions. Above a growth temperature of 900°C, AlN films wereinsulating, however, below a growth temperature of 900°C, the AlN films were conducting. The magnitude of the conductivity and the growth temperature range over which conducting AlN films could be grown were strongly influenced by the presence of a Gaflux during growth. For instance, conducting, Si-doped, AlN films were grown at a growth temperature of 940°C in the presence of a Ga flux while the films were insulating when grown in the absence of a Ga flux at this particular growth temperature. Also,by appropriate selection of the growth parameters, epilayers with n-type conductivity values as large as 0.2Ω{sup}(-1)cm{sup}(-1) for AlN and 17Ω{sup}(-1)cm{sup}(-1) for Al{sub}(0.75)Ga{sub}(0.25)N were grown in this work for the first time.
机译:作为III-V氮化物半导体家族的成员,ALN具有6.2EV的直接能量差距,作为许多应用的有希望的材料得到了很多关注。然而,尽管ALN对于各种半导体器件的有希望的属性,但是对ALN的研究已经有限,并且尚未报道N型导电ALN。本研究的目的是了解影响ALN电导率的因素并控制故意掺杂的本物质通电的电导率。在故意兴奋剂研究之前,研究了未掺杂的AlN外膜的生长。通过仔细选择底物制备方法和生长参数,建立了ALN薄膜的相对低温分子束外延生长,导致绝缘材料。发现在癫痫生长期间的故意Si掺杂导致在特定生长条件下导电膜。高于900℃的生长温度,AlN薄膜呈现,但低于900℃的生长温度,AlN薄膜进行。导电性和生长温度范围的幅度和生长温度范围在生长期间通过GaFlux的存在感到强烈影响。例如,在GA通量存在下在940℃的生长温度下,在GA通量存在下,在Ga焊剂存在下,在薄膜在这种特定生长温度下的情况下生长时,膜绝缘的生长温度在940℃的生长温度下生长。 Also,by appropriate selection of the growth parameters, epilayers with n-type conductivity values as large as 0.2Ω{sup}(-1)cm{sup}(-1) for AlN and 17Ω{sup}(-1)cm{对于Al {sub}(0.75)Ga {sub}(0.25)n第一次在这项工作中生长了sup}( - 1)。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号