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Deep level defects in Si-doped AI_xGa_(1-x)N films grown by molecular-beam epitaxy

机译:通过分子束外延生长的Si掺杂的AI_xGa_(1-x)N薄膜的深层缺陷

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The deep trap levels of Al_xGa_(1-x)N films with x in the range from 0 to 0.15 grown on c-plane sapphire substrates using rf-plasma-assisted molecular-beam epitaxy have been investigated by deep level transient spectroscopy measurements. Two distinct defect levels (denoted as E_i and D_i) were observed. The origins of the E_i and the D_i are associated with point defects such as the N vacancies and extended defects, such as the threading dislocations, respectively. According to Al content (x), the activation energy and capture cross section for the D_i defect ranged from 0.19 to 0.41 eV and 1.1-6.6 X 10~(-15) cm~2, respectively. The trap energy levels of D_i defects in Al_xGa_(1-x)N were calculated and the values were nonlinear with Al content. The bowing parameter of Al_xGa_(1-x)N films was determined to be b = 1.22.
机译:通过rf等离子体辅助分子束外延法研究了在c面蓝宝石衬底上生长的x在0到0.15之间的x范围为x的Al_xGa_(1-x)N薄膜的深陷阱能级。观察到两个不同的缺陷级别(表示为E_i和D_i)。 E_i和D_i的原点分别与点缺陷(例如N个空位)和扩展缺陷(例如螺纹位错)相关联。根据Al含量(x),D_i缺陷的活化能和俘获截面分别为0.19至0.41 eV和1.1-6.6 X 10〜(-15)cm〜2。计算了Al_xGa_(1-x)N中D_i缺陷的陷阱能级,该值与Al含量呈非线性关系。 Al_xGa_(1-x)N薄膜的弯曲参数确定为b = 1.22。

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