首页> 外文会议>Materials Research Society Symposium >Phosphorus Oxide Assisted n-type Dopant Diffusion in 4H-SiIicon Carbide
【24h】

Phosphorus Oxide Assisted n-type Dopant Diffusion in 4H-SiIicon Carbide

机译:氧化磷辅助N型掺杂剂扩散在4H-SiICon碳化物中

获取原文

摘要

Phosphorus is an important n-type dopant for both silicon and silicon carbide. Although solid-state diffusion of phosphorus in silicon has been well documented and experimentally proven, not much is known about phosphorus solid-state diffusion in silicon carbide, especially at lower temperatures. A convenient source of phosphorus for solid-state diffusion in silicon carbide is phosphorus oxide. The possibility of using phosphorus oxide as a dopant source for silicon carbide is investigated by considering the probable reactions between silicon carbide and phosphorus oxide at temperatures below 1700 K using published thermodynamic data. By considering the standard free energies of reactions, it can be shown that phosphorus can be introduced in silicon carbide at temperatures below 1700 K using phosphorus oxide. A successful development of low temperature dopant incorporation in silicon carbide would reduce the need for high temperature processes and prevent process-induced thermal degradation of critical device structures such as the oxide-semiconductor interface. Experimental results showing phosphorus impurity incorporation and activation in 4H-SiC are presented.
机译:磷是硅和碳化硅的重要N型掺杂剂。虽然硅中的固态扩散已经充分地记录并经过实验证明,但关于碳化硅中的磷固态扩散,特别是在碳化硅中的磷,特别是在较低温度下。用于固态扩散在碳化硅中的方便磷源是磷氧化物。通过考虑使用已发表的热力学数据的温度低于1700k的温度,通过考虑碳化硅和磷氧化物之间的可能反应,研究使用作为碳化硅的掺杂剂源的磷化物源的可能性。通过考虑反应的标准自由能量,可以示出在使用磷氧化物的低于1700k的温度下可以在碳化硅中引入磷。在碳化硅中的低温掺杂剂掺入的成功开发将减少对高温过程的需求,并防止工艺诱导的临界器件结构的热劣化,例如氧化物半导体界面。提出了表明4H-SiC中磷杂质掺入和活化的实验结果。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号