An Analytical Model for Intrinsic Residual Stress Effect on Out-of-Plane Deflection in Chemical-Vapor-Deposited Free-Standing Thick Film

摘要

The effect of residual stress on the out-of-plane deflection in a free-standing thick diamond films was investigated theoretically and experimentally.The deflection is believed to be caused by the variation in residual stress with film thickness.Key idea of this study is that the stress variation may be produced by gradually increasing substrate deformation resulting from the layer-by-layer deposition of the film.