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Application of ultraviolet radiation to minimize interfacial layer formation during the growth of alternate high-k gate dielectrics on Si

机译:紫外线辐射在SI上替代高k栅极电介质生长期间的界面层形成最小化

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Yttrium oxide and barium strontium titanate (BST) thin films were grown directly on Si substrates by the pulsed laser deposition (PLD) technique. Because the optimum oxygen pressure during PLD process is of the order of to mTorr, some of the oxygen atoms are trapped inside the grown films and contribute to the growth of a silicon oxide interfacial layer. The use of an UV source during the growth resulted in the reduction of the optimum oxygen pressure and, as a consequence, the amount of trapped oxygen and thickness of the interfacial layer. In addition to that, UV radiation influenced the film morphologies and electrical properties. A further reduction of the interfacial layer was obtained on substrates that were exposed prior to deposition to NH{sub}3 for short periods of time under UV radiation.
机译:通过脉冲激光沉积(PLD)技术直接在Si基板上生长氧化钇和钛酸钡(BST)薄膜。因为PLD过程中的最佳氧气压力是MTORR的顺序,所以一些氧原子被捕获在生长的薄膜内并有助于氧化硅界面的生长。在生长期间使用UV源导致最佳氧气压力的降低,因此,截障氧的量和界面层的厚度。除此之外,紫外线辐射还影响了薄膜形态和电气性能。在紫外线辐射下沉积到NH {Sub} 3之前暴露的底物上获得界面层的进一步减少。

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