Solderability study comparing the effects of barrier layers on thermally aged, tin-plated brass

摘要

Even at relatively low temperatures, tin-plated material does not remain at a steady state and will interact with other metals. This study will show the effects of the interaction of these metals and indicate trends with regards to solderability as a function of time and temperature. The presentation will also test the hypothesis that barrier layers have an effect on the rate at which these metals interact. This research will reveal, via cross-sectional analysis, metallographic evidence of how intermetallic compounds form and their deleterious effect on solderability. SEM and EDS analysis will be utilized to help describe changes happening at the surface of the tin coating.