Plastic encapsulated integrated circuits are gaining interest against their metallic or ceramic counterparts, are they are less expensive. The major drawback was however their relative poorer hermiticity. Moisture can penetrate either through the polymer or along the interface between the leads and the encapsulation resin. Manufacturers are developing new molding compounds, which are more resistant against moisture ingress. The purpose of the work is to evaluate the comportment of new generation resins relatively to the moisture penetration, and to determine how the presence of a lead frame path can affect this ingress.
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