Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range

W. H. Zhu; Sharry Ang; S. L. Gan

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Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range

机译：湿度在宽温度范围内对电子包装用模塑化合物（MC）断裂强度的影响

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来源
《Journal of Materials Science》 |2005年第6期|1533-1537|共5页
作者
W. H. Zhu; Sharry Ang; S. L. Gan;
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Assembly and Interconnect Technologies Infineon Technologies Asia Pacific Pte Ltd;

Assembly and Interconnect Technologies Infineon Technologies Asia Pacific Pte Ltd;

Assembly and Interconnect Technologies Infineon Technologies Asia Pacific Pte Ltd;

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正文语种 eng
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Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range

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