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The Moisture Absorption Properties of Liquid Type Epoxy Molding Compound for Chip Scale Package According to the Change of Fillers

机译：根据填料变化的芯片鳞片包装液体型环氧模塑化合物的吸湿性

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Whan-Gun Kim;
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年度 2010
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1. The Moisture Absorption Properties of Liquid Type Epoxy Molding Compound for Chip Scale Package According to the Change of Fillers [J] . Whan Gun Kim Journal of the Korean Chemical Society . 2010,第5期

机译：充填剂的变化引起的芯片级封装用液态环氧成型胶的吸湿性能
2. Effect of plasma treatment on adhesion strength and moisture absorption characteristics between epoxy molding compound/silicon chip (EMC/chip) interface [J] . Oh Gyung-Hwan, Joo Sung-Jun, Jeong Jae-Woo, Microelectronics & Reliability . 2019,第JANa期

机译：等离子处理对环氧模塑化合物/硅芯片（EMC /芯片）界面之间的粘合强度和吸湿特性的影响
3. Effect of vertical stacking dies on flow behavior of epoxy molding compound during encapsulation of stacked-chip scale packages [J] . C. Y. Khor, M. K. Abdullah, M. Z. Abdullah, Heat and mass transfer . 2010,第11a12期

机译：垂直堆叠模具对堆叠式芯片级封装封装过程中环氧模塑化合物流动行为的影响
4. In-situ Characterization of Moisture Absorption and Hygroscopic Swelling of an Epoxy Molding Compound for Electronic Packaging [C] . Yi He, Mohammad Kabiri North American Thermal Analysis Society conference . 2019

机译：电子包装用环氧模塑化合物的水分吸收和吸湿膨胀的原位表征
5. Moisture Absorption and Hygroscopic Swelling of Silicone/Phosphor Composite and Epoxy Mold Compound in Chip-on-Board Light Emitting Diodes [D] . Khalilullah, Ibrahim. 2017

机译：硅胶/磷光体复合物和环氧树脂复合材料中的吸湿和吸湿溶胀在芯片的发光二极管中
6. The Effects of Silica-Based Fillers on the Properties of Epoxy Molding Compounds [O] . Mitja Linec, Branka Mušič 2019

机译：二氧化硅基填料对环氧模塑化合物性能的影响
7. The Effects of Silica-Based Fillers on the Properties of Epoxy Molding Compounds [O] . Mitja Linec, Branka Mušič 2019

机译：二氧化硅基填料对环氧成型化合物性能的影响
8. Moisture Absorption of Epoxy Matrix Composites Immersed in Liquids and in Humid Air [R] . Springer, G. S., Loos, A. C. 1979

机译：浸入液体和潮湿空气中的环氧基复合材料的吸湿性

The Moisture Absorption Properties of Liquid Type Epoxy Molding Compound for Chip Scale Package According to the Change of Fillers

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