16 * 16 VCSEL Array Flip-chip bonded to CMOS VLSI Circuit

摘要

We have flip-chip bonded a 16 * 16 array of 970nm VCSELs to a Silicon CMOS circuit. The device yield after bonding and packaging of the Optoelectronic-VLSI chip is approximately 96%. Individual VCSELs are capable of being modulated by the circuit at 1Gbit/s. Parallel testing of up to 80VCSELs at 1Gbit/s per VCSEL is presented.