Flip-chip bonded VCSEL CMOS circuit with silicon monitor detector

摘要

A flip-chip bonded VCSEL CMOS circuit for preventing rearwardly emitted photons from the VCSEL from interfering with CMOS operation. The CMOS has bonding pads affixed thereto and spaced apart to define a region. The VCSEL is mounted to the bonding pads so that a lower mirror of the VCSEL is positioned between the bonding pads and in close proximity to an upper, major surface of the CMOS. A blocking layer is provided and is positioned within the region defined by the bonding pads to absorb or reflect rearwardly emitted photons from the VCSEL. In another embodiment, the blocking layer is removed and a photon detector is formed in the CMOS for collecting the rearwardly emitted photons for use in determining, inter alia, VCSEL laser power.