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Verification of Carrier Density profiles Derived From Spreading Resistance Measurements by Comparing Measured and Calculated Sheet Resistance Values

机译:通过比较测量和计算的薄层电阻值来验证衍生极性测量的载流子密度分布

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In the past, resistivity and carrier density profiles derived from spreading resistance measurements have been satisfactorily verified by comparing a doped layer's measured sheet resistance, rou sup s, with a sheet resistance value calculated from the on-bevel resistivity profile. However, this verification process has been found to fail in the case of ultrashallow source/drain implants. This paper examines all possible sources of the discrepanceybetween rou sub s-measured and rou sub s-calculated, and concludes that the lack of a sheet resistance edge correction in the standared multilayer SRP analysis is the dominant factor. The paper also discusses the role played by bevel surface damage, on-bevel carrier diffusion, and variations in carrier mobility in high dopant density regions.
机译:在过去,通过比较掺杂层的测量的薄层电阻Rou Sup S的耐刮板电阻率分布,已经令人满意地验证了散布电阻测量的电阻率和载流子密度分布。但是,已发现该验证过程在超级源/排水植入物的情况下失败。本文介绍了所有可能的差异差别ub子S测量和rou子S计算的来源,并且得出的结论是,在双层多层SRP分析中缺乏薄层电阻边缘校正是显性因素。本文还讨论了斜面表面损伤,锥载波扩散和高掺杂剂密度区域中载流子迁移率的变化所发挥的作用。

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