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Verification of Carrier Density profiles Derived From Spreading Resistance Measurements by Comparing Measured and Calculated Sheet Resistance Values

机译:通过比较测得的和计算出的薄层电阻值,验证从扩展电阻测量得出的载流子密度分布

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In the past, resistivity and carrier density profiles derived from spreading resistance measurements have been satisfactorily verified by comparing a doped layer's measured sheet resistance, rou sup s, with a sheet resistance value calculated from the on-bevel resistivity profile. However, this verification process has been found to fail in the case of ultrashallow source/drain implants. This paper examines all possible sources of the discrepanceybetween rou sub s-measured and rou sub s-calculated, and concludes that the lack of a sheet resistance edge correction in the standared multilayer SRP analysis is the dominant factor. The paper also discusses the role played by bevel surface damage, on-bevel carrier diffusion, and variations in carrier mobility in high dopant density regions.
机译:过去,通过将掺杂层的测量薄层电阻rou s与从斜角上的电阻率分布图计算出的薄层电阻值进行比较,可以令人满意地验证从扩展电阻测量得出的电阻率和载流子密度分布图。但是,已经发现在超浅源极/漏极植入的情况下,该验证过程将失败。本文研究了所有可能的测量结果与计算结果之间的差异,并得出结论,标准多层SRP分析中缺乏薄层电阻边缘校正是主要因素。本文还讨论了斜面表面损坏,斜面载流子扩散以及高掺杂物密度区域载流子迁移率变化所起的作用。

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