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NON-CONTACT SILICON EPILAYER AND SUBSURFACE CHARACTERIZATION WITH UV/MM WAVE TECHNIQUE

机译:用UV / mm波技术进行非接触式硅脱晶和地下表征

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Carrier lifetimes and interface recombination velocities in p/p~+ and n/n+~ Si epitaxial wafers are determined from the photoconductivity decays (PCDs) measured using UV/mm-wave technique. Mo and Fe are found in p/p+ Si epitaxial wafers. Gate oxide integrity (GOI) is not dependent on roughness of R_(rms) (root-mean-square surface roughness) 0.097-0.247 ran but dependent on subsurface damage induced by chemical mechanical polishing (CMP). Photoconductivity amplitude (PCA) signal measured by the UV/mm-wave technique correlates closely the gate oxide integrity yield. CMP induced by subsurface damage is removed by SCI cleaning and the procedure is monitored by the UV/mm-wave technique. Lifetimes in a denuded zone (DZ) and intrinsic gettering (IG) layer are determined from the PCA signal measured using the UV/mm-wave technique.
机译:通过使用UV / MM波技术测量的光电导析衰减(PCD)确定P / P〜+和N / N +〜Si外延晶片中的载体寿命和界面重组速度。在P / P + Si外延晶片中发现了Mo和Fe。氧化栅氧化物完整性(GOI)不依赖于R_(RMS)的粗糙度(根平均方形粗糙度)0.097-0.247,但取决于由化学机械抛光(CMP)引起的地下损伤。通过UV / MM波技术测量的光电导幅度(PCA)信号紧密相关的栅极氧化物完整性产量。通过SCI清洁除去由地下损坏引起的CMP,通过UV / MM波技术监测该过程。剥离区(DZ)和固有吸气器(IG)层中的寿命由使用UV / MM波技术测量的PCA信号确定。

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