Adhesion improvement between metal thin films (Cu and Pt) and high surface free energy polyimide by ion assisted reaction

摘要

Adhesions between metal films (Cu and Pt) and polyimide substrate were enhanced by ion assisted reaction using low energy ion beams (/spl sim/1 kV) in oxygen gas environments. In the ion assisted reaction process, ion dose and blown gas flow rate were changed from 5/spl times/10/sup 14/ to 1/spl times/10/sup 17/ ions/cm/sup 2/ and from 0 to 8 sccm, respectively. Surface free energy of polyimide film increased from 46 to 72 dyne/cm/sup 2/ by ion assisted reaction. The modified polyimide surface was observed by scanning electron microscopy and X-ray photoelectron spectroscopy, and electronegative groups such as C-O and C=O were formed on the polyimide surface without surface damage. Adhesion enhancement between metal films and polyimide modified by ion assisted reaction was confirmed by a peel test using scotch tape and a boiling test.