Lithography using focused high-energy proton beam for fabrication of high-aspect-ratio microstructures

摘要

Three dimensional microstructures with a high aspect ratio are useful for various micro-device applications including MEMS and biosensors. Proton beam writing (PBW) is a direct write process, which has been developed by F. Watt of National University of Singapore. [1] One of the most important features of the PBW is a capability of 3D micromachining owing to the deep penetrating depth into resists and the straight trajectory of MeV-energy protons. In this report, we demonstrate 3D fabrication capability of the PBW and introduce our recent activities of PBW in view of applications for MEMS and biosensors.