Formation of micro eaves analyzed by energy balance model at threefold of Cu film/DFR/Ni plating solution

摘要

DFR (Dry Film Photoresist) is widely used mainly micro plating process. However, as the result of quid intrusion into substrate/DFR interface, a bird's-beak like "eaves" is formed at bottom of a plating pattern. The purpose of this presentation is to clarify the mechanism of the "eaves" formation by analyzing adhesion energies at the substrate/DFR/liquids threefold.