RF modeling of flip-chip interconnects in coplanar waveguide circuits

摘要

The scattering-parameters of GaAs coplanar waveguide (CPW) thru line chips flip-chip mounted on an alumina substrate have been measured up to 26 GHz and a new L-R model of flip-chip interconnects has been derived based on the measured results.Also a full-wave electromagnetic simulation of CPW flip-chip interconnects has been carried out up to 40 GHz. Simulation results verify the model based on measurements. This simple lumped model is convenient for circuit design involving flip-chip CPWinterconnects.