Analysis of Polymer Flow DUE To Capillary Forces for Flip-Chip Package Designs

摘要

The IC chips of the flip-chip packages are mounted directly to substrates using a grid-array of solder bumps. The standoff regions between the chips and substrates are filled with epoxy resins to protect both the chips and the solder joint. It is important to optimize encapsulation conditions and material properties for good quality packages.