The explosive growth of wireless communications, combined with the rapid advances in high-performance portable computing, are driving the microelectronics industry toward the development of a variety of multi-functional, low-cost, compact,mixed-signal electronic products. These new products call for novel, often revolutionary, packaging practices. Some of the challenges associated with the electrical design of these packages are discussed in this paper. Examples are given of existingelectromagnetic modeling methodologies and associated CAD tools that can be used today to facilitate the design of these novel packages. The paper concludes with a brief discussion of on-going research activities toward the enhancement of thesemodeling/simulation methodologies and the eventual establishment of an electromagnetic CAD environment for mixed-signal packaging.
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