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Spectral ellipsometry on patterned wafers

机译:图案晶片上的光谱椭圆图表

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摘要

Ellipsometry has seen only limited application to the post-deposition pattern etch process despite the fact that physical parameters such as groove width, depth and pitch are as critical to product performance as the more basic thin film parameters traditionally analyzed using ellipsometry. This paper presents initial theoretical results pertaining to modeling the reflectance from a 1D etched pattern on a semiconductor substrate. To analyze the sample's effects upon the incident beam polarization, we formulate the zeroth-order reflection coefficients for the orthogonal p and s polarization states and construct models of ellipsometric parameters (Psi and Delta) for a rectangular-groove surface pattern, emphasizing the effect of groove geometry upon these quantities.
机译:椭圆形式仅在沉积后模式蚀刻工艺中仅显示了有限的应用,尽管诸如凹槽宽度,深度和间距的物理参数对产品性能具有重要的基本薄膜参数,其是传统上使用椭圆形测定法分析的更为基本的薄膜参数。本文呈现了与半导体衬底上的1D蚀刻图案建模反射率的初始理论结果。为了分析对事件光束极化的影响,我们为正交P和S偏振状态制定了零级反射系数,并构建矩形槽表面图案的椭圆形参数(PSI和DELTA)的模型,强调了沟槽几何形状在这些数量上。

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