A TECHNIQUE TO CHARACTERIZE RATE-DEPENDENT FAILURE ENVELOPES IN SURFACE MOUNT ASSEMBLIES

摘要

This paper characterizes the fatigue failure envelopes for solder damage in Printed Wiring Assemblies (PWAs) subjected to dynamic loading. An empirical, rate-dependent, power-law durability model, motivated by mechanistic considerations, is used to characterize the failure envelopes in terms of PWA flexural strain and strain rate. Explicit nonlinear finite element analysis (FEA) is used to make the damage constants independent of the specimen geometry and characterize the durability in terms of the ratio of solder plastic strain to its failure strain. A case study, using a simple PWA specimen containing a single area array component, is presented to demonstrate the proposed approach.