In order to further miniaturize electrical contacts for novelIC packaging methods and MEMS scale relays, combinedmeasurements of the electrical and mechanical properties of thinfilm metallization used in low-force contacts is required.Comprehensive data to design these low-force electrical contacts islacking because no system is readily available for measuringforces, displacements, and electrical resistance at the levels ofinterest. A new measurement system is designed to characterize thelow force behavior of thin gold films by flexibly varying theseconditions and implementing an interferometer. This newMEMS/Materials characterization system is capable of measuringdisplacements and deformations down to 0.1?, contact forces frommN to nN, and contact resistance from m? to k?, and representsthe first complete system capable of simultaneous measurements ofall these parameters.
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