首页> 外文会议>Conference on Three-Dimensional and Multidimensional Microscopy: Image Acquisition and Processing >Evaluation of different illumination designs for tunable 3D structured illumination microscopy through model-based restoration
【24h】

Evaluation of different illumination designs for tunable 3D structured illumination microscopy through model-based restoration

机译:基于模型的恢复评估可调谐3D结构照明显微镜的不同照明设计

获取原文
获取外文期刊封面目录资料

摘要

In a tunable 3D structured illumination microscopy (3D-SIM) based on an illumination system comprised by a multi-slit array and a Fresnel biprism, the 3D structured illumination (SI) pattern depends on the design of the slit array. Previous work studied the impact of the illumination pattern design on the achieved extension of the compact support of the tunable 3D-SIM optical transfer function. In this contribution, we use simulations with different illumination designs that utilize a different number of slits, to evaluate system performance by investigating the lateral and axial resolution achieved in the restored images computed with a regularized iterative 3D model-based algorithm, which minimizes the mean square error between the model and data. Three illumination designs are investigated in which the number of slits is N= 3, 9 and 11 while the corresponding distance between the slits is x_0= 488 μrn, 122μm and 100 μm, respectively. A 3D star-like object, commonly used in resolution analysis of imaging systems, is used in the simulations. Results are quantified using the mean square error and the structured similarity index as well as intensity profiles that show the achieved resolution and robustness to noise in each case. The lateral and axial 3D-SIM theoretical resolution limits are achieved in the presence of 20-dB Poisson noise while small differences are evident in the results from 15-dB simulated data obtained using the 3 investigated designs.
机译:在可调谐3D结构化照相显微镜(3D-SIM)基于由多狭缝阵列和菲涅耳双流发射的照明系统,3D结构照明(SI)模式取决于狭缝阵列的设计。以前的工作研究了照明图案设计对可调谐3D-SIM光学传递函数紧凑载体的延伸的影响。在这一贡献中,我们使用利用不同数量的狭缝的不同照明设计的模拟来评估系统性能,通过调查用基于正规化的迭代3D模型的算法计算的恢复图像中实现的横向和轴向分辨率来评估系统性能,这最小化平均值模型和数据之间的方误差。研究了三个照明设计,其中狭缝的数量是n = 3,9和11,而狭缝之间的相应距离分别是X_0 =488μRN,122μm和100μm。在模拟中使用常用于成像系统分辨率分析的3D星形对象。使用均方误差和结构相似度指数以及强度轮廓来量化结果,以及显示在每种情况下实现的分辨率和稳健性的强度轮廓。横向和轴向3D-SIM理论分辨率限制在20-DB泊松噪声的存在下实现,而在使用3所研究的设计获得的15-DB模拟数据的结果中,差异很小。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号