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A scheduling approach for chemical vapour deposition processes in the production of semiconductors

机译:半导体生产中化学气相沉积过程的调度方法

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The production of semiconductors for applications in microelectronics is operated through photo-lithographic and chemical processes whereof Chemical Vapor Deposition (CVD) technology is one of the most used. CVD processes need to operate in furnaces under controlled atmosphere and, every time the furnace is accessed from the external environment, a purging time is needed to restore the prescribed atmosphere. The optimisation of the utilisation of the furnaces depends on the sequencing of loading and unloading operations entailing the need to disturb the controlled atmosphere. We propose the use of a disaggregated time formulation based on step variables to model a scheduling problem aiming at identifying the optimal sequence of operations and supporting the definition of optimal dispatching policies.
机译:通过光刻和化学方法操作微电子应用的半导体,其中化学气相沉积(CVD)技术是最常用的。 CVD工艺需要在受控气氛下在炉中操作,并且每次从外部环境都有炉子,需要净化时间来恢复规定的大气。炉子利用的优化取决于加载和卸载操作的排序,需要扰乱受控气氛。我们提出了基于步骤变量的分解时间制定来模拟旨在识别最佳操作序列的调度问题并支持最佳调度策略的定义。

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