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Comparisons in L32 2k-Factorial and L25 Taguchi for the 16 nm FinFET Statistical Optimization Applications

机译:L32 2K级和L25 Taguchi的比较为16 NM FinFET统计优化应用

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This project examines and analyzes the process parameter variance towards on-state drive current (I_(ON)) and leakage current (I_(OFF)) towards the 16 nm double-gate FinFET (DG-FinFET) device by the implementation of 2k-factorial design, with comparisons made against an L_(25) Taguchi statistical method. Alterations with two levels for six process parameters consisting of the threshold voltage (V_(TH)) doping dose, V_(TH) doping tilt, polysilicon doping dose, polysilicon doping tilt, Source and Drain (S/D) doping dose and S/D doping tilt will be done to analyze and improve the results of both I_(ON) and I_(OFF). The physical characteristics of the device will be defined on the ATHENA module, with the ATLAS module then used to characterize its electrical properties. Consideration is made with the responses from both modules by the assistance of the L32 2κ-factorial design to reduce the device's variability as well as maximizing the value of I_(ON) while minimizing the I_(OFF) value. By achieving both values, the I_(ON)/I_(OFF) ratio are able to be maximized in order to reduce the power consumption of the device subsequently. The most dominant factor towards both I_(ON) and I_(OFF) values is identified with polysilicon doping tilt, showcasing the largest standardized effects at the end of this experiment. The optimum values achieved with 2κ-factorial design with I_(ON) and I_(OFF) at 1648.48 μA/μm and 42.096 pA/μm respectively while achieving better I_(ON)/I_(OFF) ratio with 39.160 × 10~6 as its I_(ON) have surpassed the value of I_(ON) achieved in Taguchi method that was valued at 1559.96 μA/μm. Importantly, the results acquired have met the predictions of the International Technology Roadmap Semiconductor (ITRS) 2013 for the year 2020.
机译:该项目检查并分析了通过执行2K-向16 nm Double-Gate FinFET(DG-FINFET)设备朝向状态驱动电流(I_(ON))和漏电流(I_(OFF))的过程参数方差。因子设计,与L_(25)Taguchi统计方法进行比较。六个过程参数的改变,六个过程参数由阈值电压(V_(TH))掺杂剂量,V_(TH)掺杂倾斜,多晶硅掺杂剂量,多晶硅掺杂倾斜,源极和漏极(S / D)掺杂剂量和S / D掺杂倾斜将进行以分析和改进I_(ON)和I_(OFF)的结果。设备的物理特性将在雅典娜模块上定义,然后使用ATLAS模块来表征其电气属性。通过L32 2κ级设计的帮助,使用来自两个模块的响应进行考虑,以降低设备的可变性,并最大限度地提高I_(ON)的值,同时最小化I_(OFF)值。通过实现两个值,能够最大化I_(ON)/ I_(OFF)比率以便随后降低设备的功耗。 I_(上)和I_(OFF)值的最主导因素是用多晶硅掺杂倾斜识别的,展示了该实验结束时最大的标准化效果。用2张(上)和I_(OFF)和I_(OFF)分别在1648.48μA/μm和42.096PA /μm的情况下实现的最佳值,同时实现了39.160×10〜6的更好的I_(ON)/ I_(OFF)比例。它的I_(ON)超过了在1559.96μA/μm的塔卢奇方法中实现的I_(ON)的值。重要的是,获得的结果已经达到了2020年国际技术路线图半导体(ITRS)2013的预测。

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