Advantages of Using RGA as Part of Atomically Clean Surface (ACS?) for Sub-10 nm Parts Cleaning Process

摘要

The ability to detect and mitigate moisture, hydrocarbons and other types of contamination from cleaned parts is becoming more critical as semiconductor technology nodes progress to and beyond the 10 nm threshold. QuantumClean* incorporates residual gas analyzers (RGAs) tor Atomically Cleaned Surface? (ACS"*) process development for critically cleaned chamber components. ACS'" processes provide solutions for critical parts cleaning and address critical defect concerns such as the detection and elimination of moisture, metallic, ionic, organic, particulate contamination. Component outgassmg rate affects post-PM recovery time, which is important to end users. Decreasing recovery time increases product throughput and decreases production cost Materials used during cleaning and packaging, including gloves and wipes, are also factors in cleaned part final cleanliness. The present work addresses some of the challenges, solutions, and learning afforded by RGA use at various stages of the parts cleaning development process.