Advanced Substrate Applied Fluxing Underfill for Bonding of Fine Pitch Solder Capped Cu Pillars to Oxidized Cu Substrates - (PPT)

摘要

Demonstrated a new fluxing NCP material that enables Cu substrates for fine pitch TCB processes - Maintains good thermal mechanical properties; - Suitable for die-2-wafer bonding (long substrate times in bonders). Demonstrated screen printing method for high efficiency dispensing of (fluxing) NCPs.