In this study, we have investigated the wiring on the curved surfaces with nanoimprint technology using the flexible resin mold. The maximum transfer ratios of line & space structures of polyetherimide (PEI) and cyclic olefin copolymer (COC) were higher than 93% by using thermal nanoimprint process. It found that the silver nano-ink can be transferred to the curved surfaces using the UV curable resin as the adhesive material. The wired on curved surfaces using a flexible polymer mold, silver nano-ink, and UV curable resin as an adhesive showed the electrical conduction indicated. Therefore, the possibility to apply nanoimprint technology to wiring on three-dimensional surface features was indicated.
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