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Simulating Massively Parallel Electron Beam Inspection for sub-20 nm Defects

机译:模拟亚20 nm缺陷的大型平行电子束检验

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SEMATECH has initiated a program to develop massively-parallel electron beam defect inspection (MPEBI). Here we use JMONSEL simulations to generate expected imaging responses of chosen test cases of patterns and defects with ability to vary parameters for beam energy, spot size, pixel size, and/or defect material and form factor. The patterns are representative of the design rules for an aggressively-scaled FinFET-type design. With these simulated images and resulting shot noise, a signal-to-noise framework is developed, which relates to defect detection probabilities. Additionally, with this infrastructure the effect of detection chain noise and frequency dependent system response can be made, allowing for targeting of best recipe parameters for MPEBI validation experiments, ultimately leading to insights into how such parameters will impact MPEBI tool design, including necessary doses for defect detection and estimations of scanning speeds for achieving high throughput for HVM.
机译:Sematech已启动一个程序以开发大规模平行的电子束缺陷检查(MPEBI)。在这里,我们使用JMONSEL模拟来生成所选择的测试例的预期成像响应,以及能够改变光束能量,光斑尺寸,像素尺寸和/或缺陷材料和形状因子的参数的能力。该模式代表了焦尺寸缩放的FinFET型设计的设计规则。利用这些模拟图像和产生的镜头噪声,开发了一种信号 - 噪声框架,其涉及缺陷检测概率。另外,通过这种基础设施,可以进行检测链噪声和频率相关系统响应的效果,允许针对MPEBI验证实验的最佳配方参数定位,最终导致探讨这些参数如何影响MPEBI工具设计,包括必要的剂量用于实现HVM高吞吐量的扫描速度的缺陷检测和估计。

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