WIRE SWEEP ANALYSIS IN TRANSFER MOLDING AND COMPRESSION MOLDING PROCESS FOR SEMICONDUCTOR CHIP ENCAPSULATION

摘要

A simulation program for prediction of wire-sweep during transfer molding and compression molding of thermoset materials for semiconductor chip encapsulation has been developed. The flow simulation necessary for wire-sweep analysis is based on a three-dimensional model. The simulation results were compared to the experimental results from an industrial case of transfer molding. A method to reduce wire sweep during transfer molding and compression molding is also discussed.