COMPRESSION MOLDING METHOD OF A SEMICONDUCTOR CHIP FOR PREVENTING WRINKLE GENERATION ON A RELEASE FILM AND A COMPRESSION MOLDING SHAPE

摘要

PURPOSE: A compression molding method of a semiconductor chip and a compression molding shape are provided to improve product productivity by preventing bending of a substrate after completing a molding process.;CONSTITUTION: A partition member(21) is arranged on a predetermined position of the leading end surface of a cavity base member. A plurality of partition cavities(22) is formed within a female mold cavity. The height of the partition member is the thickness of a partition resin molded body(3). The partition resin molded body is formed by pressurizing resin within the partition cavity. A groove part for preventing a substrate bending phenomenon is formed corresponding to the shape of the partition member between partition resin molded bodies.;COPYRIGHT KIPO 2012