Pulsed Current Electrodeposition of Mn-Cu Alloys on SUS 430 Substrate as Coating Material for SOFC Interconnect Application

摘要

In the present study, several series of pulse current electrodeposition experiment have been carried out at 25°C in various electrolyte bath under different current densities to find the suitable electrodeposition condition for fabricating Mn-Cu alloys coating. The deposition kinetic of Mn-Cu alloy was assessed from the measurement of cathodic polarization behavior in selected electrolyte bath. The uniformity of Mn-Cu alloy coating, and its composition were studied by scanning electron microscope (SEM) equipped with energy dispersive spectroscopy (EDS) analysis. The results shows that a dense, adherent, smooth and uniform Mn-Cu alloy coating can be deposited on SUS 430 substrate with relatively high deposition rate. The evaluation of coating area specific resistance (ASR) at 700°C shows a value of 0.04 Ωcm~2. This result indicates that Mn-Cu alloy is promising as alternative coating materials for SOFC interconnect.