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Speciation During Wet Etching of III-V Semiconductors

机译:III-V半导体的湿法蚀刻过程中的形态

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The concentration of volatile arsenic species above GaAs during etching with aqueous HF and HCl was measured via mass spectrometry. The total arsenic detected above solutions with acid concentrations between 0.6 M and 28.9 M was consistently between 4 and 5 mg/m~3. The mass fragments detected contained As-H and As-O moieties. No volatile species containing gallium were detected. Inductively-coupled plasma mass spectrometry (ICP-MS) was performed on aqueous HF solutions and used with the vapor phase concentrations to close a mass balance on arsenic to within 1-2 nmol. Vapor phase species containing As-O bonds were produced by hydrolysis and increased with etching time. The hydrolysis of these species complicated the identification of specific products in the vapor phase.
机译:通过质谱法测量通过HF和HCl水溶液蚀刻期间GaAs上述GaAs挥发砷的浓度。在0.6μm和28.9μm的酸浓度之间检测到以上溶液的总砷始终在4-5mg / m〜3之间。检测到的质量片段包含AS-H和AS-O部分。检测到含镓的不挥发物种。对含水HF溶液进行电感耦合等离子体质谱(ICP-MS),并与气相浓度一起使用,以在1-2nmol内缩小砷的质量平衡。通过水解产生含有AS-O键的气相物质并随着蚀刻时间而增加。这些物种的水解使蒸汽相中特定产物的鉴定复杂化。

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